Product Feature HY-9300# is a kind of low viscosity, Inherent flame resistance; two components addition cured potting silicone with both room temperature and high temperature cured. The higher temperature is the faster cure it will be. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. The European Union ROHS level can be achieved. It is mainly applied to electronic components surface with materials of PC(Poly-carbonate)、PP、ABS、PVC, etc. and metal materials, without any by products. Typical Application HY-9300# is suitable for - Precision Electronic Components, - DC/DC module and circuit board protection which requires high transparency and recovery. TECHNICAL GUIDELINES 1, please put part A and part B in separate container and stir evenly before mixing the two parts together. 2, Mixing Ratio: part A: part B = 1:1 (By weight) 3. De-air the mixture in vacuum pump under 0.08 MPa for 3-5 minutes. 4, The temperature influences the curing time of HY-9300#. When under low temperature, we suggest to appropriately heat the mixture to accelerate vulcanization. Suggestive operation time and temperature: Under temperature of 80�00� the silicone will cure in 15 minutes, while under 25�room temperature, the silicone will cure around 8 hours. PACKAGE 20Kg/pail (Part A10Kg + Part B10Kg) SHELF LIFE AND TRANSPORTATION 1. Twelve(12) months from date of shipment when stored at 24C in original unopened packages. 2. This kind of product is non-dangerous product, it can be transported as general chemicals. 3. Products exceed the storage life should be confirmed normal before using. Any further information required, pls contact Mr. Jensen